Featuring a permanent polyester (PEN) liner that allows reworking and enhances mechanical compliance in low-stress applications, Bergquist announce that the Gap Pad 1450 has joined the Gap Pad family of thermally conductive gap filling thermal interface materials.
Offering high thermal conductivity of 1.3W/m-K, Gap Pad 1450 is available in six thicknesses in the range of 0.508-3.175mm. The standard sheet size is 8x16". Custom, die-cut parts are also available to special order.
With its clear PEN liner, Gap Pad 1450 is also puncture and tear resistant thereby helping protect components and preserve electrical isolation. The un-lined side maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. In addition, the material has greater natural tack than similar ultra-soft materials, which saves applying adhesive and hence helps maximise the thermal performance of assemblies.
Gap Pad 1450 is suitable for applications such as solid-state lighting and other LED assemblies, computer and telecommunication equipment, and generally between heat-generating semiconductors and heatsinks, particularly where strain on fragile component leads must be minimised.
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